Inova in Germany plans to double its workforce to around 100 engineers as it ramps up its third family of automotive communications chips.
The development of the APXpress communications chips is progressing on schedule for 2028/29. APXpress enables high-performance, redundant SerDes communications with bandwidths of 32 Gbit/s per lane, enabling the bundling of different bus systems in the vehicle and simplifying data transport.
These will be used for communication between in-car sensors, zonal gateways and high-performance computing (HPC) systems as they support the OSI transport layers 1 to 3 to carry any uncompressed data such as video, radar and lidar with deterministic latency within the vehicle.
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This will also provide a 30% reduction in system cost, power and resource requirements is targeted to meet the increasing demands of the automotive environment. The data is made available in its entirety in the vehicle network, beyond traditional point-to-point connections. This reduces the weaknesses of other bus systems.
The company moved into new headquarters in Munich in January to provide space for organic growth, building on its LED lighting controller technology. The move is part of a five-year growth strategy aimed at strong expansion, particularly in Asia and North America.
“By moving to our new site, we are making a statement about the future development of the company. The location not only provides more space for our team, but also the ideal basis for further expanding our international partnerships and continuing our success story as an innovative German semiconductor company,” said Robert Isele, CEO of Inova Semiconductors.
“Inova is driving the fundamental communication of the Software Defined Vehicle (SDV), providing vehicle manufacturers with a solution to meet the complex data transport and security requirements of the connected vehicle era with minimal software, minimal packaging and maximum flexibility,” said Isele.
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