Renesas Electronics has launched its first automotive-qualified system on chip for the Bluetooth Low Energy (BLE).
The chip (above) integrates a 2.4GHz BLE radio transceiver, an ARM M0+ microcontroller, memory, peripherals and security in a footprint of 22pin chipscale WFFCQFN package measuring 3.5 x 3.5 mm. This also makes it the smallest BLE chip on the market.
The software stack in the DA14533 is qualified against Bluetooth Core 5.3 and is aimed at applications from tire pressure monitoring and keyless entry to wireless sensors and battery management systems.
This can be used for designs such as determining the position of wheels with techniques like Angle-of-Arrival (AoA) and Angle-of-Departure (AoD) to identify individual wheel positions accurately, as well as enabling fleet operators to monitor tire pressure, fuel efficiency, and predictive maintenance through cloud-connected Bluetooth LE systems. Advanced Driver Assistance Systems (ADAS) can also use the chip for wireless sensor networks to provide critical data for improved vehicle safety.
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The chip builds on the SmartBond Tiny family of consumer BLE chips, adding extended temperature range operation from -40 to +105°C with AEC-Q100 Grade 2 qualification.
The device includes an integrated DC-DC buck converter, which accurately adjusts the output voltage according to system requirements. This achieves an active system power consumption of only 3.1mA during transmission and 2.5mA during reception. In hibernation mode, the current drops to 500nA.
These power management and power-saving features help extend the operational life of small-capacity battery-powered systems and meet the stringent power requirements of tire pressure monitoring systems’ mission profile.
“Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date,” said Chandana Pairla, VP of Connectivity Solutions Division at Renesas. “This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems.”
The DA14533 only requires 6 external components as a single external crystal oscillator (XTAL) is used for both active and sleep modes, eliminating the need for a separate oscillator for sleep mode.
Renesas has combined the chip with the R-Car H3/M3/E3 SoCs, power management PMICs and timing devices for a Tire Pressure Monitoring System reference design.
The DA14533 is available today, along with the Bluetooth Low Energy SoC Development Kit Pro. The kit includes a motherboard, daughterboard, and cables to facilitate application software development. The daughterboard is also available by itself to simplify development.
renesas.com/products/wireless-connectivity/bluetooth-low-energy
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